Self-adjustable heat spreader system for set-top box assemblies

ABSTRACT

Systems, electronic devices, and methods are directed to a self-adjustable heat spreader. A spring system may include one or more spring members and a contact surface adapted to contact a circuit board component. Each spring member may include a thermally conductive material. A thermal spreader plate may be coupled to the one or more spring members. The spring system and the thermal spreader plate may be configured to allow movement, with respect to the thermal spreader plate along multiple axes, of one or more portions of the one or more spring members proximate to the thermal spreader plate when the contact surface is pressed against the circuit board component and the spring system transitions from a first state to a compressed state. The contact surface and the spring system may be configured to transfer heat between the circuit board component and the thermal spreader plate.

BACKGROUND

The present disclosure relates in general to set-top box assemblies,and, more specifically, but not by way of limitation, to self-adjustableheat spreader systems for set-top box assemblies.

Certain components of set-top box assemblies for television receivers,such microprocessor chips and other circuit board devices, are sourcesof heat. Design variables of set-top box assemblies for televisionreceivers, of set-top box enclosures for the set-top box assemblies, ofcircuit board assemblies for the set-top box assemblies, of circuitboard components for the circuit board assemblies, and/or the likecreate problems for effectively handling heat produced by the devices.In many instances, there exists a gap between a circuit board componentand a top cover of an enclosure of a set-top box assembly for atelevision receiver. Thus, oftentimes, an opposing cover and/or opposingdevices float above the circuit board component.

There is a need in the set-top box assembly space for solutions to theseproblems that address wide variations of design tolerances, includingvariations in gaps between circuit board components and other structuralcomponents. This and other needs are addressed by the presentdisclosure.

BRIEF SUMMARY

The present disclosure relates in general to set-top box assemblies,and, more specifically, but not by way of limitation, to self-adjustableheat spreader systems for set-top box assemblies.

In one aspect, a self-adjustable heat spreader system is disclosed. Theself-adjustable heat spreader system may include any one or combinationof the following. A spring system may include one or more spring membersand a contact surface adapted to contact a circuit board component. Eachspring member of the one or more spring members may include a thermallyconductive material. A thermal spreader plate may be coupled to the oneor more spring members. The spring system and the thermal spreader platemay be configured to allow movement, with respect to the thermalspreader plate along multiple axes, of one or more portions of the oneor more spring members proximate to the thermal spreader plate when thecontact surface is pressed against the circuit board component and thespring system transitions from a first state to a compressed state. Thecontact surface and the spring system may be configured to transfer heatbetween the circuit board component and the thermal spreader plate.

In another aspect, an electronic device is disclosed. The electronicdevice may include an enclosure that may enclose any one or combinationof the following. A spring system may include one or more spring membersand a contact surface adapted to contact a circuit board component. Eachspring member of the one or more spring members may include a thermallyconductive material. A thermal spreader plate may be coupled to the oneor more spring members. The spring system and the thermal spreader platemay be configured to allow movement, with respect to the thermalspreader plate along multiple axes, of one or more portions of the oneor more spring members proximate to the thermal spreader plate when thecontact surface is pressed against the circuit board component and thespring system transitions from a first state to a compressed state. Thecontact surface and the spring system may be configured to transfer heatbetween the circuit board component and the thermal spreader plate.

In yet another aspect, a method of assembling an electronic device isdisclosed. The method may include assembling within an enclosure any oneor combination of the following. A spring system may include one or morespring members and a contact surface adapted to contact a circuit boardcomponent. Each spring member of the one or more spring members mayinclude a thermally conductive material. A thermal spreader plate may becoupled to the one or more spring members. The spring system and thethermal spreader plate may be configured to allow movement, with respectto the thermal spreader plate along multiple axes, of one or moreportions of the one or more spring members proximate to the thermalspreader plate when the contact surface is pressed against the circuitboard component and the spring system transitions from a first state toa compressed state. The contact surface and the spring system may beconfigured to transfer heat between the circuit board component and thethermal spreader plate.

In various embodiments, the one or more portions of the one or morespring members may abut the thermal spreader plate and slide along thethermal spreader plate when the contact surface is pressed against thecircuit board component and the spring system transitions from the firststate to a compressed state. In various embodiments, the first state maycorrespond to an uncompressed state of the spring system. In variousembodiments, the contact surface may correspond to at least a portion ofa thermally conductive piece coupled to each spring member of the one ormore spring members. In various embodiments, the thermal spreader platemay be coupled to the enclosure.

In various embodiments, a second spring system may include a second setof one or more spring members and a second contact surface, where eachspring member of the second set of one or more spring members may bethermally conductive. A second thermal spreader plate may be coupled tothe second set of one or more spring members. The spring system, thethermal spreader plate, the second spring system, and the second thermalspreader plate may be disposed in opposing positions to contact acircuit board and/or the circuit board component.

In various embodiments, a second spring system may include a second setof one or more spring members and a second contact surface, where eachspring member of the second set of one or more spring members isthermally conductive. A second thermal spreader plate may be coupled tothe second set of one or more spring members. The second spring systemand the second thermal spreader plate may be configured to allow theseconds contact surface is pressed against a second circuit boardcomponent when the second spring system transitions to a secondcompressed state. The circuit board component and the second circuitboard component may be disposed in different planes.

Further areas of applicability of the present disclosure will becomeapparent from the detailed description provided hereinafter. It shouldbe understood that the detailed description and specific examples, whileindicating various embodiments, are intended for purposes ofillustration only and are not intended to necessarily limit the scope ofthe disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

A further understanding of the nature and advantages of variousembodiments may be realized by reference to the following figures. Inthe appended figures, similar components or features may have the samereference label. Further, various components of the same type may bedistinguished by following the reference label by a dash and a secondlabel that distinguishes among the similar components. When only thefirst reference label is used in the specification, the description isapplicable to any one of the similar components having the same firstreference label irrespective of the second reference label.

FIG. 1 illustrates an end-user system, in accordance with certainembodiments of the present disclosure.

FIG. 2A illustrates a schematic, partial cross-sectional view of aset-top box assembly in a partially exploded state, in accordance withcertain embodiments of the present disclosure.

FIG. 2B illustrates a schematic, partial cross-sectional view of theset-top box assembly in an assembled state, in accordance with certainembodiments of the present disclosure.

FIG. 3 illustrates a cross-section of a portion of the set-top boxassembly in an exploded state, in accordance with certain embodiments ofthe present disclosure.

FIG. 4 illustrates a top view and a side view of the heat spreaderassembly, in accordance with certain embodiments of the presentdisclosure.

FIG. 5 illustrates a cross-sectional view of the heat spreader assemblyin an expanded state and a cross-sectional view of the heat spreaderassembly in a compressed state, in accordance with certain embodimentsof the present disclosure.

FIG. 6 illustrates a top view, a side view, and a perspective view ofthe heat spreader assembly, in accordance with certain embodiments ofthe present disclosure.

FIG. 7 illustrates a top view, side views, and a perspective view of theheat spreader assembly, in accordance with certain embodiments of thepresent disclosure.

FIG. 8 illustrates a top view, a side view, and a perspective view ofthe heat spreader assembly, in accordance with certain embodiments ofthe present disclosure.

FIG. 9 illustrates a cross-section of a set-top box assembly includingan opposing spring configuration to allow for a floating board andgreater design tolerances, in accordance with certain embodiments of thepresent disclosure.

FIG. 10 illustrates a cross-section of a set-top box assembly includingan a configuration that allows for adjustment to accommodate differentnon-parallel planes, in accordance with certain embodiments of thepresent disclosure.

FIG. 11A illustrates a side view and a cross-section of a heat spreaderassembly configured to allow for heater spreader adjustment along threeaxes, in accordance with certain embodiments of the present disclosure.

FIG. 11B illustrates a side view and a cross-section of the heatspreader assembly in one non-limiting example state of adjustment withrespect to two axes, in accordance with certain embodiments of thepresent disclosure.

FIG. 12 illustrates a schematic, partial cross-sectional view of aset-top box assembly in an uncompressed state and a schematic, partialcross-sectional view of the set-top box assembly in a compressed state,in accordance with certain embodiments of the present disclosure.

DETAILED DESCRIPTION

The ensuing description provides preferred exemplary embodiment(s) only,and is not intended to limit the scope, applicability or configurationof the disclosure. Rather, the ensuing description of the preferredexemplary embodiment(s) will provide those skilled in the art with anenabling description for implementing a preferred exemplary embodimentof the disclosure. It should be understood that various changes may bemade in the function and arrangement of elements without departing fromthe disclosure as set forth in the appended claims.

Specific details are given in the following description to provide athorough understanding of the embodiments. However, it will beunderstood by one of ordinary skill in the art that the embodimentsmaybe practiced without these specific details. For example, circuitsmay be shown in block diagrams in order not to obscure the embodimentsin unnecessary detail. In other instances, well-known circuits,processes, algorithms, structures, and techniques may be shown withoutunnecessary detail in order to avoid obscuring the embodiments.

Also, it is noted that the embodiments may be described as a processwhich is depicted as a flowchart, a flow diagram, a data flow diagram, astructure diagram, or a block diagram. Although a flowchart may describethe operations as a sequential process, many of the operations can beperformed in parallel or concurrently. In addition, the order of theoperations may be re-arranged. A process is terminated when itsoperations are completed, but could have additional steps not includedin the figure. A process may correspond to a method, a function, aprocedure, a subroutine, a subprogram, etc. When a process correspondsto a function, its termination corresponds to a return of the functionto the calling function or the main function.

The present disclosure relates in general to set-top box assemblies,and, more specifically, but not by way of limitation, to self-adjustableheat spreader systems for set-top box assemblies. As previously noted,certain components of set-top box assemblies for television receivers,such microprocessor chips and other circuit board devices, are sourcesof heat. Design variables of set-top box assemblies for televisionreceivers, of set-top box enclosures for the set-top box assemblies, ofcircuit board assemblies for the set-top box assemblies, of circuitboard components for the circuit board assemblies, and/or the likecreate problems for effectively handling heat produced by the devices.In many instances, there exists a gap between a circuit board componentand a top cover of an enclosure of a set-top box assembly for atelevision receiver. Thus, oftentimes, an opposing cover and/or opposingdevices float above the circuit board component.

Certain embodiments of the present disclosure may solve the accumulativetolerance problems and the heat problems simultaneously. Certainembodiments may provide for a thermal solution that efficiently utilizesa gap between a circuit board component and a cover of an enclosure of aset-top box assembly for a television receiver. Certain embodiments mayprovide for a self-adjustable heat spreader system that is flexible toaccommodate design variables of set-top box assemblies for televisionreceivers, set-top box enclosures, of circuit board assemblies, circuitboard components, and/or the like. With self-adjustable heat spreadersystems according to certain embodiments, set-top box assemblies fortelevision receivers may achieve power savings, improved energy use,improved efficiency, and improved device functioning, capabilities, andperformance.

Various embodiments will now be discussed in greater detail withreference to the accompanying figures, beginning with FIG. 1.

FIG. 1 illustrates an end-user system 100, in accordance with certainembodiments of the present disclosure. FIG. 1 is a simplifiedillustration of an embodiment of an end-user system 100, in accordancewith certain embodiments of the present disclosure. The end-user system100 may include the television tuner device 170, which may be a set-topbox (STB) in certain embodiments, and an end-user display device 180.The display 180 can be controlled by a user 150 using a user inputdevice 175 that can send wireless signals 176 to communicate with thetelevision tuner device 170 and/or display 180. The media serviceback-end 110 may provide media in various forms.

FIG. 2A illustrates a schematic, partial cross-sectional view of aset-top box assembly 200 in a partially exploded state, in accordancewith certain embodiments of the present disclosure. In FIG. 2A, a heatspreader system 202 is in a non-compressed state within an enclosure 204of the set-top box assembly 200. The set-top box assembly 200 mayinclude a first portion 210 and a second portion 220 that may beassembled together and that comprise the set-top box assembly 200. Inthe non-limiting example depicted, the first portion 210 corresponds toa lower assembly portion, whereas the second portion 220 corresponds toan upper assembly portion.

The set-top box assembly 200 may include the enclosure 204, which may beincluded the second portion 220 as depicted, and/or in the first portion210 in various embodiments. Within the first portion 210, there may becircuit components 206 arranged on a substrate 208 (which may be circuitboard). The circuit components 206 may include one or more heatproducing components 210. For example, the heat producing components 212may correspond to a circuit board component, such as a microprocessor,an integrated circuit chip, and/or another chip component, in variousembodiments.

In the non-limiting example depicted, the opposing second portion 220may include the heat spreader system 202, though other embodiments mayhave the first position 210 including the heat spreader system 202. Theheat spreader assembly 202 may be attached, removably attached, slidablyattached, and/or attachable to a surface 214 of the second portion 220.In some embodiments, the surface 214 may correspond to the enclosure204. In some embodiments, as depicted in the non-limiting example, thesurface 214 may correspond to a substrate 216 such that the heatspreader assembly 202 does not directly abut the enclosure 204. Thus, invarious embodiments, the heat spreader assembly 202 may be directly orindirectly coupled to the enclosure 204.

FIG. 2B illustrates a schematic, partial cross-sectional view of theset-top box assembly 200 in an assembled state, in accordance withcertain embodiments of the present disclosure. In the non-limitingexample depicted, the first portion 210 is shown as assembled with thesecond portion 220. The first portion 210 may include a base adapted toreceive the second portion 220. The first portion 210 and the secondportion 220 may be assembled and attached to one another in any suitablemanner. In FIG. 2B, the heat spreader system 202 is depicted in acompressed state within the enclosure 204 of the set-top box assembly200 when the first portion 210 and the second portion 220 are assembledtogether. In the compressed state, the heat spreader system 202 has comeinto contact with the heat producing component 212.

FIG. 3 illustrates a cross-section of a portion 300 of a set-top boxassembly 200-1 in an exploded state, in accordance with certainembodiments of the present disclosure. A heat spreader assembly 302 maybe disposed opposite a board assembly 206-1. The board assembly 206-1may have disposed thereon a heat producing component 212-1, which may bea circuit board component.

The heat spreader assembly 302 may be configured to self-adjust tocontact the heat producing component 212-1. In some embodiments, theheat spreader assembly 302 may be configured to assist in supporting theheat producing component 212-1 in place against the assembly board orother substrate 208-1. In some embodiments, the heat spreader assembly302 may be configured to lock the heat producing component 212-1 inplace against the assembly board or other substrate 208-1. Further, withcertain embodiments, the heat spreader assembly 302 may not directlycontact the heat producing component 212-1, but may indirectly contactthe heat producing component 212-1 by way of one or more intermediateheat transferring components.

The heat spreader assembly 302 may include the heat spreader system202-1, which may correspond to a thermally conductive spring system202-1. In various embodiments, the heat spreader system 202-1 may beattached, fixedly attached, removably attached, and/or attachable to thesubstrate 216-1. In some embodiments, the heat spreader system 202-1 maybe adjustably attached to the substrate 216-1. For example, the heatspreader system 202-1 may include a sliding mechanism so that at least aportion of the heat spreader system 202-1 proximate to and/or abuttingthe substrate 216-1 may move (e.g., slide) in two or more directionswith respect to the substrate 216-1. Hence, some embodiments includesliding mechanism that that allow for multi-axial adjustment so that atleast a portion of the heat spreader system 202-1 proximate to and/orabutting the substrate 216-1 may slide with respect multiple axes.

In various embodiments, the substrate 216-1 may be the enclosure 204 ora portion of the enclosure 204. The enclosure 204 may correspond to anexterior portion of the set-top box assembly 200-1 (e.g., an exteriorcover). In various embodiments, the substrate 216-1 may be attacheddirectly or indirectly to the enclosure 204. While the non-limitingexample depicted illustrate the substrate 216-1 in one particularposition and orientation, the substrate 216-1 may be disposed atdifferent positions in various embodiments. For example, the substrate216-1 may be positioned along with a side cover, bottom cover, a coverhaving a surface at one or more oblique angles with respect to a bottomreference surface, etc.

The heat spreader system 202-1 may be an integrated, thermallyconductive spring system that conducts heat from the heat producingcomponent 212-1 to a surface of the substrate 216-1 of the set-top boxassembly 200. The heat spreader system 202-1 may include one or morethermally conductive spring members 310. In some embodiments, the one ormore thermally conductive spring members 310 may be swaged to thethermal expansion plate 216.

Certain embodiment of the heat spreader system 202-1 may include thermalconductors 318 that extend from the spring members 310 (in someembodiments, through the spring members 310) into the substrate 216-1.The thermal conductors 318 may facilitate heat transfer from the heatspreader system 202-1 (e.g., from the spring members 310) to thesubstrate 216-1. With some embodiments, the thermal conductors 318 mayextend into, through, and beyond the substrate 216-1. The thermalconductors 318 facilitate heat transfer from the heat spreader system202-1 to the substrate 216-1 and beyond the substrate 216-1 to one ormore other media such as the enclosure 204, ambient air, a thermalexpansion plate, and/or the like. In some embodiments, the thermalconductors 318 may facilitate attachment of the heat spreader system202-1 to the substrate 216-1.

The one or more thermally conductive spring members 310 may be attachedto a thermally conductive block 314 and configured such that thethermally conductive block 314 may be configured to make contact withthe heat producing component 212-1 and/or one or more intermediate heattransferring components. Though the thermally conductive block 314 mayhave a block form in some embodiments, the thermally conductive block314 may have a non-block form in other embodiments (e.g., a circularshaped pad or any suitable geometric form). With some embodiments, thethermally conductive block 314 may be formed to be integral with the oneor more thermally conductive spring members 310. In some embodiments,the thermally conductive block 314 may be swaged the one or morethermally conductive spring members 310. In various embodiments, thethermally conductive block 314 may be attached, fixedly attached,removably attached, slidably attached, pivotably attached, and/orattachable to the one or more thermally conductive spring members 310.With certain embodiments, the thermally conductive block 314 may beattached to the one or more thermally conductive spring members 310 withone or more connectors 320, which may be thermally conductive to furtherfacilitate heat transfer from the thermally conductive block 314 to thethermally conductive spring members 310. The one or more connectors 320,in various embodiments, may include one or more sliding mechanisms(e.g., sliding connectors) and/or one or more pivoting mechanisms (e.g.,ball-socket connectors) so that the thermally conductive block 314 maymove (e.g., slide or tilt) in two or more directions and/or orientationswith respect to the spring members 310. Hence, some embodiments mayprovide a point of articulation and/or single- or multi-axial adjustmentfor the thermally conductive block 314.

FIG. 4 illustrates a top view 400 and a side view 420 of the heatspreader assembly 302-1, in accordance with certain embodiments of thepresent disclosure. As depicted, the heat spreader assembly 302-1 mayinclude a thermal expansion plate 216-2. In some embodiments, thethermal expansion plate 216-2 may correspond to the substrate 216,216-1. The top view 400 depicts the heat spreader assembly 302 with afour-spring spring system 202-1. The multiple spring system embodimentsmay be configured to ensure that balanced forces are applied to circuitboard components. Various embodiments may provide thermally conducivespring systems 202 based on a different number of spring members, suchas one spring member, two spring members, three spring members, fivespring members, or more spring members.

The components of the heat spreader assembly 302 may be made of any oneor combination of suitably conductive materials. For example, in someembodiments, the thermal expansion plate 216 may be or otherwise includealuminum. As another example, in some embodiments, the one or morethermally conductive spring members 310 and/or the thermally conductiveblock 314 may be or otherwise include copper. In various embodiments inthe alternative or in addition, the thermal expansion plate 216, the oneor more conductive spring members 310, and/or the block 314 may includeone or more other thermally conductive materials. In the one or moreconductive spring members 310, the balance between the conductivecharacteristics and the spring characteristics may be optimized. Forexample, greater forces imparted by the spring characteristics maycorrespond to some extent to greater conductivity as the greater forcesensure strong contact that leads to better heat transferring.Conversely, weaker forces imparted by the spring characteristics maycorrespond to some extent to weak contact and less heat transfer. Thespring characteristics may be optimized for limited distances of travel.By way of example without limitation, accumulative tolerances for acontact surface of a chip may be ±1.0 mm, which may require taking intoaccount 2.0 mm while still imparting strong contact. Further, the springcharacteristics may be optimized for ranges of acceptable forces thatmay be applied to circuit board components, which ranges may be based atleast in part on staying within limits specified for particular circuitboard components.

FIG. 5 illustrates a cross-sectional view 502 of the heat spreaderassembly 302-1 in an expanded state and a cross-sectional view 504 ofthe heat spreader assembly 302-1 in a compressed state, in accordancewith certain embodiments of the present disclosure. During the processof assembling the set-top box assembly 200, the thermally conductiveblock 314 may contact the circuit board component 212 first, then thespring system 202 may flex until the unit cover of the enclosure 204 iscompletely closed. The spring system 202 may ensure that the thermallyconductive block 314 contacts and is biased against the circuit boardcomponent 212, and may transfer the heat away at the same time.

FIG. 6 illustrates a top view 600, a side view 620, and a perspectiveview 640 of a heat spreader assembly 602, in accordance with certainembodiments of the present disclosure. As depicted, the heat spreaderassembly 602 may include a thermal expansion plate 216-3. Attached tothe thermal expansion plate 216-3 may be a closed spring system 202-2.In the non-limiting example depicted, the closed spring system 202-2 mayinclude two conductive spring members 310 coupled together with thethermally conductive block 314. In an alternative embodiment of thenon-limiting example depicted, the closed spring system 202-2 mayinclude one integral conductive spring members 310 formed to have twowings, each wing having an end portion coupled to the thermal expansionplate 216-3. While certain embodiments may include the thermallyconductive block 314, certain embodiments of the heat spreader assembly602 may not include the thermally conductive block 314 to contact thecircuit board component 212. Accordingly, is some embodiments, theclosed spring system 202-2 may be adapted to directly contact thecircuit board component 212.

FIG. 7 illustrates a top view 700, side views 720 and 730, and aperspective view 740 of the heat spreader assembly 702, in accordancewith certain embodiments of the present disclosure. The heat spreaderassembly 702 may include multiple closed spring systems 202-3, 202-4coupled to a thermal expansion plate 216-4. The multiple closed springsystems 202-3, 202-4 may be configured to have varying dimensions,positions, and orientations.

FIG. 8 illustrates a top view 800, a side view 820, and a perspectiveview 840 of the heat spreader assembly 802, in accordance with certainembodiments of the present disclosure. The heat spreader assembly 802may include a combination of a four-spring spring system 202-5 and anopen spring system 202-6. The open spring system 202-6 may include asingle spring member 310-2. In various embodiments, the open springsystem 202-6 may or may not include a thermally conductive block 314-3.

FIG. 9 illustrates a cross-section 900 of a set-top box assembly 902including an opposing spring configuration to allow for a floating boardand greater design tolerances, in accordance with certain embodiments ofthe present disclosure. The set-top box assembly 902 may includemultiple circuit boards. The depicted example illustrates an embodimentwith two circuit boards: a main circuit board 206-2 and a secondarycircuit board 206-3. Other embodiments are possible, such as embodimentshaving a different number of main circuit boards and/or secondarycircuit boards.

The main circuit board 206-2 may be supported and stabilized by acoordinated bottom heat spreader system 902A and a top heat spreadersystem 902B. While the illustrated embodiment specifies heat spreadersystems with top and bottom denotations, certain embodiments may havevarious orientations of coordinated heat spreader systems, such ascoordinated side orientations (e.g., left and right systems, front andback systems, etc. for vertically oriented circuit boards) andcoordinated systems any suitable angles (e.g., for circuit boardsoriented at any suitable angles).

Referring to the non-limiting example of FIG. 9, the bottom heatspreader system 902A may be configured to support the main circuit board206-2 from below. The bottom heat spreader system 902A may include oneor more thermally conductive spring systems disposed to make contact orindirectly support and/or stabilize the main circuit board 206-2. Asillustrated, thermally conductive spring systems 202-7 and 202-8 areincluded in the bottom heat spreader system 902A to support and/orstabilize the main circuit board 206-2, while facilitating thermaltransfer away from circuit board components (e.g., circuit boardcomponent 212-2) of the main circuit board 206-2. Some embodiments ofthe thermally conductive spring systems 202-7 and/or 202-8 may include athermally conductive block 314 disposed proximate to and/or abut circuitboard component(s) 212-2.

As illustrated, in certain embodiments, the secondary circuit board206-3 may be coupled to the main circuit board 206-2. In someembodiments, the secondary circuit board 206-3 may be attached to maincircuit board 206-2. Accordingly, the thermally conductive springsystems 202-7 and 202-8 in the bottom heat spreader system 902A mayindirectly support and/or stabilize the secondary circuit board 206-3.In various embodiments, the secondary circuit board 206-3 may be coupledto the main circuit board 206-2 at partially with a thermally conductivespring systems 202-11 (which may be an open spring system, in someembodiments) and/or a heat sink 202-11, which may be disposed proximateto and/or abut circuit board component(s) 212-3 to facilitate thermaltransfer away from circuit board components circuit board component(s)212-3. As illustrated, thermally conductive spring systems 202-9 and202-10 are included in the top heat spreader system 902B to supportand/or stabilize the main circuit board 206-2 and the secondary circuitboard 206-3, while facilitating thermal transfer away from circuit boardcomponents 212-2, 212-3.

The bottom heat spreader system 902A and the top heat spreader system902B may be configured to allow for the main circuit board 206-2 and thesecondary circuit board 206-3 to be suspended between the bottom heatspreader system 902A and the top heat spreader system 902B. Suchcoordinated suspension may allow for greater design tolerances withadjustable distances 905A and 905B. In various instances, the adjustabledistances 905A and 905B may be equivalent or different. In variousembodiments, the set-top box assembly 902 may include one or moreadjustment guides 915A, 915B. The depicted example shows two adjustmentguides 915A, 915B. An adjustment guide 915 may stabilize the maincircuit board 206-2 and guide and/or restrict adjustments of theadjustable distances 905A and 905B. In some embodiments, the adjustmentguide 915A, 915B may each include a bottom member 916 and top member 917configured to limit the adjustable distances 905A and 905B when the maincircuit board 206-2 may make contact with the bottom member 916 or thetop member 917. With various embodiments, the bottom member 916 and thetop member 917 may be attached to the enclosure 204. Various embodimentsmay include the bottom member 916 or the top member 917 being attachedto the enclosure 204 in any suitable manner. Certain embodiments mayinclude an intermediate guide member 918 that may be attached to thebottom member 916 and the top member 917 in any suitable manner. Theguide member 918 may, in some embodiments, act as a lateral guide tolimit and restrict the movements of the main circuit board 206-2. Forexample, the guide member 918 may extend through an aperture in the maincircuit board 206-2 or may be disposed near an edge of the main circuitboard 206-2 in order to limit, guide, and/or restrict lateral movement(e.g., movement in a direction perpendicular to the directions of theadjustable distances 905A and 905B) of the main circuit board 206-2.

FIG. 10 illustrates a cross-section 1000 of a set-top box assembly 1002including an a configuration that allows for adjustment to accommodatedifferent non-parallel planes, in accordance with certain embodiments ofthe present disclosure. A variety of enclosures 204 in variousembodiments may have different shapes other than box shapes. Forexample, some enclosures 204 may have round or otherwise curvedenclosures, portions that are curved, and/or portions that are acutelyor obtusely angled. FIG. 10 depicts one possible enclosure 204-2 (out ofmany possible examples) with an angled portion. The set-top box assembly1002 may include multiple circuit boards. The depicted exampleillustrates an embodiment with two circuit boards: a main circuit board206-4 and a secondary circuit board 206-5, disposed in non-parallelplanes. Other embodiments are possible, such as embodiments having adifferent number of main circuit boards and/or secondary circuit boards.

A heater spreader system 202, such the example depicted or another heatspreader system, may be arranged to address heat transfer from the maincircuit board 206-4. The secondary circuit board 206-5, as in theillustrated embodiment, may be disposed along an angled side 204A of theenclosure 204-2. A heater spreader system 202-13 may be coupled tomultiple sides 204A, 204B of the enclosure 204-2 in any suitable manner.In some embodiments, as depicted, the heater spreader system 202-13 maybe directly attached to side 204B and to the secondary circuit board206-5 in any suitable manner, such as disclosed herein. In variousalternative embodiments, the heater spreader system 202-13 may bedirectly attached to one or more sides of the enclosure 204 withoutbeing attached to the secondary circuit board 206-5, for example, sothat the heater spreader system 202-13 straddles the secondary circuitboard 206-5. Other alternative embodiments may include the heaterspreader system 202-13 being directly attached to the secondary circuitboard 206-5 without being attached to one or more sides of the enclosure204.

FIG. 11A illustrates a side view 1100 and a cross-section 1120 of a heatspreader assembly 1102 configured to allow for heater spreaderadjustment along three axes, in accordance with certain embodiments ofthe present disclosure. FIG. 11B illustrates a side view 1101 and across-section 1121 of the heat spreader assembly 1102 in onenon-limiting example state of adjustment with respect to two axes, inaccordance with certain embodiments of the present disclosure. Thoughbi-axial movement is depicted for the sake of simplicity, tri-axialadjustment is possible with the heat spreader assembly 1102.

As disclosed above, in various embodiments, the thermally conductiveblock 314 may be attached, fixedly attached, removably attached,slidably attached, pivotably attached, and/or attachable to the one ormore thermally conductive spring members 310. In the depicted examplesof FIGS. 11A and 11B, the thermally conductive block 314-6 may move(e.g., tilt) in two or more directions and/or orientations with respectto the spring members 310-3. The thermally conductive block 314-6 maymovably connected to the spring members 310-3 with a pivoting connector1115, which may, for example, include a ball joint filled with thethermal grease. Other embodiments, such as a sliding connector joint,are possible.

FIG. 12 illustrates a schematic, partial cross-sectional view 1220 of aset-top box assembly 1200 in an uncompressed state and a schematic,partial cross-sectional view 1240 of the set-top box assembly 1200 in acompressed state, in accordance with certain embodiments of the presentdisclosure. Certain circuit board components 212 may require extracaution during application of a load with the heat spreader assembly202. So a straight “down” (e.g., along a normal to a surface of thecircuit board components 212) assembly method may be an option to applythe force evenly on the circuit board components 212 with the heatspreader assembly 202. However, if the enclosure 204 does not allow astraight down assembly method (e.g., with enclosure 204-3 where aportion 204C and a portion 204D are hingedly interconnected), themultiaxially adjusting heat spreader 202-13 may be used to evenly applyforce to the circuit board component 212-6. Accordingly, certainembodiments that provide one or more points of articulation and/orsingle- or multi-axial adjustment may help avoid damaging circuit boardcomponents 212.

The methods, systems, and devices discussed above are examples. Variousconfigurations may omit, substitute, or add various procedures orcomponents as appropriate. Features described with respect to certainconfigurations may be combined in various other configurations.Different aspects and elements of the configurations may be combined ina similar manner. Also, technology evolves and, thus, many of theelements are examples and do not limit the scope of the disclosure orclaims. Moreover, while the above description is directed to set-top boximplementations, certain embodiments may be applied to other devicesinvolving heat-producing circuit board components.

Specific details are given in the description to provide a thoroughunderstanding of example configurations (including implementations).However, configurations may be practiced without these specific details.For example, well-known circuits, processes, algorithms, structures, andtechniques have been shown without unnecessary detail in order to avoidobscuring the configurations. This description provides exampleconfigurations only, and does not limit the scope, applicability, orconfigurations of the claims. Rather, the preceding description of theconfigurations will provide those skilled in the art with an enablingdescription for implementing described techniques. Various changes maybe made in the function and arrangement of elements without departingfrom the spirit or scope of the disclosure.

Also, configurations may be described as a process which is depicted asa flow diagram or block diagram. Although each may describe theoperations as a sequential process, many of the operations can beperformed in parallel or concurrently. In addition, the order of theoperations may be rearranged. A process may have additional steps notincluded in the figure.

Having described several example configurations, various modifications,alternative constructions, and equivalents may be used without departingfrom the disclosure. For example, the above elements may be componentsof a larger system, wherein other rules may take precedence over orotherwise modify the application of the disclosure. Also, a number ofsteps may be undertaken before, during, or after the above elements areconsidered. Accordingly, the above description does not bind the scopeof the claims.

Also, the terms in the claims have their plain, ordinary meaning unlessotherwise explicitly and clearly defined by the patentee. The indefinitearticles “a” or “an,” as used in the claims, are defined herein to meanone or more than one of the element that the particular articleintroduces; and subsequent use of the definite article “the” is notintended to negate that meaning. Furthermore, the use of ordinal numberterms, such as “first,” “second,” etc., to clarify different elements inthe claims is not intended to impart a particular position in a series,or any other sequential character or order, to the elements to which theordinal number terms have been applied.

What is claimed is:
 1. A self-adjustable heat spreader system,comprising: a first spring system comprising: a first set of one or morespring members; and a first contact surface adapted to contact a firstcircuit board component, wherein each spring member of the first set ofone or more spring members comprises a thermally conductive material;and a first thermal expansion plate coupled to the first set of one ormore spring members, wherein the first set of one or more spring memberscomprises at least one spring member that extends from a first pointtoward a second point so as to partially define a space between thefirst contact surface and the first thermal expansion plate and to atleast partially support the first contact surface in a position that isopposite from the first thermal expansion plate across the space,wherein: the first point corresponds where the at least one springmember is coupled with the first thermal expansion plate; the secondpoint corresponds to where the at least one spring member is coupledwith the first contact surface; and the first point is not directlybetween the first contact surface and the first thermal expansion plate;wherein the first spring system is configured to allow movement of thefirst contact surface with respect to the first thermal expansion platealong multiple axes when the first contact surface is pressed againstthe first circuit board component and when the first spring systemtransitions to a compressed state; wherein the first contact surface andthe first spring system are configured to transfer heat between thefirst circuit board component and the first thermal expansion plate. 2.The self-adjustable heat spreader system of claim 1, wherein: one ormore portions of the first set of one or more spring members abut thefirst thermal expansion plate and slide along the first thermalexpansion plate when the first contact surface is pressed against thefirst circuit board component and the first spring system transitionsfrom a first state to the compressed state.
 3. The self-adjustable heatspreader system of claim 2, wherein: the first state corresponds to anuncompressed state of the first spring system.
 4. The self-adjustableheat spreader system of claim 1, wherein: the first contact surfacecorresponds to at least a portion of a thermally conductive piececoupled to each spring member of the first set of one or more springmembers.
 5. The self-adjustable heat spreader system of claim 1,wherein: the first thermal expansion plate is coupled to an enclosure.6. The self-adjustable heat spreader system of claim 1, furthercomprising: a second spring system comprising a second set of one ormore spring members and a second contact surface, wherein each springmember of the second set of one or more spring members is thermallyconductive; and a second thermal expansion plate coupled to the secondset of one or more spring members; wherein the first spring system, thefirst thermal expansion plate, the second spring system, and the secondthermal expansion plate are disposed in opposing positions to contact acircuit board and/or the first circuit board component.
 7. Theself-adjustable heat spreader system of claim 1, further comprising: asecond spring system comprising a second set of one or more springmembers and a second contact surface, wherein each spring member of thesecond set of one or more spring members is thermally conductive; and asecond thermal expansion plate coupled to the second set of one or morespring members; wherein the second spring system and the second thermalexpansion plate are configured to allow the second contact surface to bepressed against a second circuit board component when the second springsystem transitions to a second compressed state; wherein the firstcircuit board component and the second circuit board component aredisposed in different planes.
 8. An electronic device, comprising: anenclosure that encloses: a circuit board; a first circuit boardcomponent; a first spring system comprising: a first set of one or morespring members; and a first contact surface adapted to contact the firstcircuit board component, wherein each spring member of the first set ofone or more spring members comprises a thermally conductive material;and a first thermal expansion plate coupled to the first set of one ormore spring members, wherein the first set of one or more spring memberscomprises at least one spring member that extends from a first pointtoward a second point so as to partially define a space between thefirst contact surface and the first thermal expansion plate and to atleast partially support the first contact surface in a position that isopposite from the first thermal expansion plate across the space,wherein: the first point corresponds where the at least one springmember is coupled with the first thermal expansion plate; the secondpoint corresponds to where the at least one spring member is coupledwith the first contact surface; and the first point is not directlybetween the first contact surface and the first thermal expansion plate;wherein the first spring system is configured to allow movement of thefirst contact surface with respect to the first thermal expansion platealong multiple axes when the first contact surface is pressed againstthe first circuit board component and when the first spring systemtransitions to a compressed state; wherein the first contact surface andthe first spring system are configured to transfer heat between thefirst circuit board component and the first thermal expansion plate. 9.The electronic device of claim 8, wherein: one or more portions of thefirst set of one or more spring members abut the first thermal expansionplate and slide along the first thermal expansion plate when the firstcontact surface is pressed against the first circuit board component andthe first spring system transitions from a first state to the compressedstate.
 10. The electronic device of claim 9, wherein: the first statecorresponds to an uncompressed state of the first spring system.
 11. Theelectronic device of claim 8, wherein: the first contact surfacecorresponds to at least a portion of a thermally conductive piececoupled to each spring member of the first set of one or more springmembers.
 12. The electronic device of claim 8, wherein: the firstthermal expansion plate is coupled to the enclosure.
 13. The electronicdevice of claim 8, further comprising: a second spring system comprisinga second set of one or more spring members and a second contact surface,wherein each spring member of the second set of one or more springmembers is thermally conductive; and a second thermal expansion platecoupled to the second set of one or more spring members; wherein thefirst spring system, the first thermal expansion plate, the secondspring system, and the second thermal expansion plate are disposed inopposing positions to contact the circuit board and/or the first circuitboard component.
 14. The electronic device of claim 8, furthercomprising: a second spring system comprising a second set of one ormore spring members and a second contact surface, wherein each springmember of the second set of one or more spring members is thermallyconductive; and a second thermal expansion plate coupled to the secondset of one or more spring members; wherein the second spring system andthe second thermal expansion plate are configured to allow the secondcontact surface to be pressed against a second circuit board componentwhen the second spring system transitions to a second compressed state;wherein the first circuit board component and the second circuit boardcomponent are disposed in different planes.
 15. A method of assemblingan electronic device, the method comprising: assembling, within anenclosure: a circuit board; a circuit board component; a first springsystem comprising: a first set of one or more spring members; and afirst contact surface adapted to contact the circuit board component,wherein each spring member of the first set of one or more springmembers comprises a thermally conductive material; and a first thermalexpansion plate coupled to the first set of one or more spring members,wherein the first set of one or more spring members comprises at leastone spring member that extends from a first point toward a second pointso as to partially define a space between the first contact surface andthe first thermal expansion plate and to at least partially support thefirst contact surface in a position that is opposite from the firstthermal expansion plate across the space, wherein: the first pointcorresponds where the at least one spring member is coupled with thefirst thermal expansion plate; the second point corresponds to where theat least one spring member is coupled with the first contact surface;and the first point is not directly between the first contact surfaceand the first thermal expansion plate; wherein the first spring systemis configured to allow movement of the first contact surface withrespect to the first thermal expansion plate along multiple axes whenthe first contact surface is pressed against the circuit board componentand when the first spring system transitions to a compressed state;wherein the first contact surface and the first spring system areconfigured to transfer heat between the circuit board component and thefirst thermal expansion plate.
 16. The method of claim 15, wherein: oneor more portions of the first set of one or more spring members abut thefirst thermal expansion plate and slide along the first thermalexpansion plate when the first contact surface is pressed against thecircuit board component and the first spring system transitions from afirst state to the compressed state.
 17. The method of claim 16,wherein: the first state corresponds to an uncompressed state of thefirst spring system.
 18. The method of claim 15, wherein: the firstcontact surface corresponds to at least a portion of a thermallyconductive piece coupled to each spring member of the first set of oneor more spring members.
 19. The method of claim 15, wherein: the firstthermal expansion plate is coupled to the enclosure.
 20. The method ofclaim 15, further comprising: a second spring system comprising a secondset of one or more spring members and a second contact surface, whereineach spring member of the second set of one or more spring memberscomprises is thermally conductive; and a second thermal expansion platecoupled to the second set of one or more spring members; wherein thefirst spring system, the first thermal expansion plate, the secondspring system, and the second thermal expansion plate are disposed inopposing positions to contact the circuit board and/or the circuit boardcomponent.